Spindle Error Analyzer
Machine qualification
Spindle Analyzer Systems

Spindle Error Analyzer

Spindle performance can be critical to the quality, productivity and efficiency of a machine. When you need absolute confidence in your spindle performance, the Spindle Error Analyzer is the industry leading solution for in-depth spindle accuracy and performance assessment.

Product features:

Accuracy

High performance non-contact measurement with sub-nm resolution.

Quality

Tests compliant to latest ISO230 standards.

Advanced analysis

Dynamic spindle performance, thermal drift, spindle tilt, reversal errors and shift versus rpm built in.

Flexibility

Suitable for a wide range of ultra precision and high speed spindles and rotary.

At IBS we have been specialists in spindle measurement and optimisation for decades. We apply this not only for our customers machines but also for the ultra precision machines we build. Together with our partner in non-contact sensor technology, Lion Precision, we offer the Spindle Error Analyzer (SEA). This outstanding solution for spindle quality control  gives  best-in-class, clear and uncompromising results.

The system works by installing a precision target in the tool holder. Spindle motion is measured with non-contact capacitive probes mounted in a precision fixture. State-of-the-art algorithms analyse the results which are presented in easy to read charts and graphs

Applications

  • Optimization of  spindle design
  • Demonstration of spindle performance
  • Understanding complex spindle problems
  • Clear machine commissioning with ISO standard measurements
  • Machine acceptance
Spindle Error Analyzer
Spindle Error Analyzer

Multi Probe Analyzer for SEA

An extension-kit for the SEA system designed to achieve ultra-precision in spindle measurements. It provides enhanced analysis and separation of
target geometrical errors, to reveal the true spindle performance up to nanometer level.

At a glance

The Multi Probe Analyzer (MPA) system is a valuable addition to the Spindle Error Analyzer (SEA) system. In specific ultra-precision scenarios where the spindle error motion can become in the same order of magnitude as the target form errors, the need to distinguish between individual contributions of spindle motion and target geometry arises. The add-on kit has been developed to separate this target geometrical error from the measurement data revealing the true spindle error motion. The MPA is aimed at spindles with errors of the order of 500 nm and below and measures spindle and target errors to nanometer level.

The multi-probe-ring for on the SEA tool allows for analysis using the 8mm capacitive sensors. The included software provides a detailed analysis with ISO 230-7 parameters of the spindle and the target in a PDF report.

Unique strengths

  • Enhanced-accuracy in sub-micron spindle metrology
  • Separation of spindle and target error motion to nanometer level
  • Simple add-on kit to SEA
  • PDF report showing true spindle and target errors
  • No extra capacitive sensors needed
Download the leaflet

The extension-kit includes:

  • Multi Probe Analyzer ring - for mounting the 3 capacitive sensors at the optimized angles
  • Mounting material - for quick and stable attachment to your SEA system
  • Software package - for seamless measurement and automatic data report generation

Accurate spindle profile characterization

The MPA measurement method reveals the spindle error motion through the application of 3 sensors at optimized sensor angles. The chosen configuration enables reliable separation of errors up to 150 undulations per revolution (UPR), which is well beyond the typical harmonic content encountered in practical applications. The revealed spindle error motion comes with an error result to nanometer level. This new method is for sub-micron accurate spindles, from 500nm and below. The combination of high-resolution measurement and quantified uncertainty ensures reliable characterization, giving you confidence in your measured spindle performance.

Spindle error measured by SEA

03.6.2-SEA-Measurement

A typical SEA measurement uses two probes in the same plane, positioned 90° around the target. This results in a combined error of spindle and target, meaning the observed behavior does not represent the true spindle behavior.

Sensor signals using MPA

03.6.2-MPA-Measurement

By placing three probes in the same plane at optimized angles, spindle error motion can be separated from the target error. Harmonic content up to 150 UPR can be extracted.

Separated spindle & target error measured by MPA

03.6.2-Seperated-Signals

The separated signal from the spindle and target reveal the significant impact of target errors to the measured error. This means in our example above, SEA measures 238 nm of spindle error, MPA reveals a true spindle error of 202 nm.

Downloads

IBS Brochures

Spindle Analyzer Systems

Download the brochure ⟶

IBS Brochures

SEA component options

Download the brochure ⟶

 

Multi Probe Analyzer for SEA

Download the leaflet ⟶

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