When your product requires a dedicated measurement solution, we can deliver a machine made to order.
We have solved amazing challenges with our customers. Read about just some of the solutions we have created below.
A platform was required for nanoimprint technology demanding precision overlay for maximum yield. A machine was designed and delivered for sub‑100 nm precision across large area (m²) surfaces. The platform delivers the display industry the precision and large scale production capability demanded for the next generation of augmented reality and AI wearables.
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Automation of an XY-stage calibration was required, determining 35 parameters. A full 2D grid solution with nanometre precision was developed, eliminating operator multiple 1D line measurement. The system delivered a major time reduction compared to the previous CMM-based process whilst improving precision with automatic compensation to the stage controller.
An ultra precision measurement machine was required for next generation large scale optics for the semicon industry. Measurement requirements included a repeatability of 2 nm and ultra clean design. Positioning in 6 degrees of freedom, the machine delivers high accuracy positioning with picometer resolution. A repeatability of 0.2nm was achieved while delivering on all cleanliness requirements.
A qualification tool was required for a precision sample stage used to manipulate samples in five degrees of freedom. The performance of the stage should be validated with regard to position repeatability, accuracy of movement, dynamics and vacuum performance. A tool was designed and delivered providing X,Y,Z measurement repeatability of 1nm.
As part of the ALICE detector upgrade, CERN required a sensor module assembly machine. ALICIA was developed to measure and assemble the 15,000 sensor chips which make up the new detector. Working closely with CERN teams across the globe, the machine accommodated changing requirements as the sensor chip technology developed; from chip size to positioning accuracy and test protocols. The whole assembly and inspection procedure of one sensor module generates 0.5 terabytes of information. The collection and processing of this amount of big data was an additional challenge which was solved. The first machine, ALICIA 1, passed the site acceptance test at CERN and seven more machines have since been delivered to sites around the globe.
The customer had a need for measurement of ultra precision dampers specified to nanometer performance accuracy. The solution was VisEE, which delivers automated measurement of the dynamic stiffness characteristics of a range of damper types, in a temperature controlled environment. Advanced analytics were implemented to extract the required performance characteristics. Standard reports simplify complex damper characteristics to workable KPIs for the production operator.
A solution was required in production for the measurement of automotive cooling pipes produced to micrometer accuracy. LETO measures length, endform and thickness parameters to a range of ISO standards with user defined tolerances. By combining multiple measurements into one machine, improving measurement accuracy, implementing international quality standards and automation of the process, this measurement machine has taken the quality control process a generation forward for the customer.
A cylinder measurement machine was required for the printing industry. Twenty years earlier a state-of-the art machine had been delivered. Still in service, the customer was looking towards the next generation of products and an increase in product sizes. The challenge was to measure products varying in length from 0,20m to 5m and weights up to 300kg. Advanced co-ordinate metrology was implemented to translate sensor data to product specifications. Air bearing technology allows near frictionless linear and rotation movements to support micron level accuracy and repeatability.
A nano accuracy semiconductor wafer measurement machine was required. The solution delivers doubled-sided measurement of bow, warp and TTV (total thickness variation) of up to 12 inch silicon wafers. Spiral scanning enables high throughput, high resolution measurement.
