Susan is a double sided 300 mm wafer measuring machine, using capacitive measurement technology. Susan has been developed to measure up to 300 mm wafers according to the common SEMI wafer specifications, like bow, warp and thickness.
Using an adapter plate the machine can be accommodated to measure 100 mm, 150 mm and 200 mm wafers. Because of the versatility of Susan, sliced as well as rough ground wafers can be easily measured.
The modular structure of Susan allows the usage of an additional optical high resolution sensor, thus increasing the performance of the machine by enhancing its features as regards to surface roughness measurement.
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